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| TECHNICAL DATA IN74ACT32 Quad 2-Input OR Gate High-Speed Silicon-Gate CMOS The IN74ACT32 is identical in pinout to the LS/ALS32, HC/HCT32. The IN74ACT32 may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. * TTL/NMOS Compatible Input Levels * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 4.5 to 5.5 V * Low Input Current: 1.0 A; 0.1 A @ 25C * Outputs Source/Sink 24 mA ORDERING INFORMATION IN74ACT32N Plastic IN74ACT32D SOIC TA = -40 to 85 C for all packages LOGIC DIAGRAM PIN ASSIGNMENT FUNCTION TABLE Inputs PIN 14 =VCC PIN 7 = GND A L L H H B L H L H Output Y L H H H Rev. 00 IN74ACT32 MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 20 50 50 750 500 -65 to +150 260 Unit V V V mA mA mA mW C C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TJ TA IOH IOL tr, tf * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Junction Temperature (PDIP) Operating Temperature, All Package Types Output Current - High Output Current - Low Input Rise and Fall Time (except Schmitt Inputs) * Min 4.5 0 -40 Max 5.5 VCC 140 +85 -24 24 Unit V V C C mA mA ns/V VCC =4.5 V VCC =5.5 V 0 0 10 8.0 VIN from 0.8 V to 2.0 V This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74ACT32 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol VIH VIL VOH Parameter Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage Test Conditions VOUT= VCC-0.1 V VOUT=0.1 V or VCC-0.1 V IOUT -50 A VIN=VIH or VIL IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT 50 A * * Guaranteed Limits 25 C 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 0.1 -40C to 85C 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 1.0 1.5 75 -75 4.0 40 A mA mA mA A V Unit V V V V 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 5.5 5.5 5.5 5.5 5.5 VIN=VIL IOL=24 mA IOL=24 mA IIN ICCT IOLD IOHD ICC Maximum Input Leakage Current Additional Max ICC/Input +Minimum Dynamic Output Current +Minimum Dynamic Output Current Maximum Quiescent Supply Current (per Package) VIN=VCC or GND VIN=VCC - 2.1 V VOLD=1.65 V Max VOHD=3.85 V Min VIN=VCC or GND * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. Rev. 00 IN74ACT32 AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V 10%, CL=50pF,Input tr=tf=3.0 ns) Guaranteed Limits Symbol Parameter 25 C Min tPLH tPHL CIN Propagation Delay, Input A or B to Output Y (Figure 1) Propagation Delay, Input A or B to Output Y (Figure 1) Maximum Input Capacitance 1.0 1.0 4.5 Max 9.0 9.0 -40C to 85C Min 1.0 1.0 4.5 Max 10.0 10.0 ns ns pF Unit Typical @25C,VCC=5.0 V CPD Power Dissipation Capacitance 20 pF Figure 1. Switching Waveforms Rev. 00 IN74ACT32 N SUFFIX PLASTIC DIP (MS - 001AA) A 14 8 B 1 7 Dimension, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38 10 3.81 8.26 0.36 0.56 1.78 F L D F C -T- SEATING N G D 0.25 (0.010) M T K PLANE G H H J M J K L M N NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D SUFFIX SOIC (MS - 012AB) Dimension, mm 8 A 14 Symbol A MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0 0.1 0.19 5.8 0.25 MAX 8.75 4 1.75 0.51 1.27 H B P B C 1 G 7 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEATING PLANE H J F M J K M P R 8 0.25 0.25 6.2 0.5 NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side. Rev. 00 |
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